0.5um Die Bonder
Model: MRSI-S-HVM
Next generation ultra high accuracy solution for speed and flexibility Applications & Features.
- MRSI-S-HVM designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine.
- Designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, multi-processes production in one machine
- Two Modes with auto-change over: ±0.5μm @ 3σ and ±1.5μm @ 3σ; both with on-axis z-force for die bonding. MRSI proprietary high z-force option available.
- Capable of Chip-on-Wafer (CoW); Chip-on-Interposer (CoI); Silicon photonics; die from III-V wafer (8 inches) pick & place onto a silicon wafer (12 inches) and mapping
- Multiple processes, including DAF, eutectic, epoxy stamping and dispensing, thermal heating from top and bottom, and MRSI proprietary bottom laser soldering.
- Flip chip bonding with direct alignment of fiducials on both bonding interfaces without additional reference or calibration required.
- MRSI proprietary wafer table with automated leveling
- MRSI-S-HVM inherited all of the MRSI-HVM’s parallel processes using MRSI proprietary auto tool change and dual gantry/head.
- Material input methods include wafer, Waffle pack, and Gel-Pak®, as well as customized fixtures.
Value to our Customer
- Industry-leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing, multiple process options.
- With the switch between 0.5 micron and 1.5 micron modes there is an ability to balance the different accuracy chips/dies assembling within one machine to provide the best throughput and ROI for customers.
- Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
- Industry-leading local technical support teams and application expertise
- 35+ years of experiences in the industry with reliable 24/7 field operation