Solder Paste Inspection (SPI)
Model：Meister S
Premium In-line 3D SPI System With the Fastest Speed and Best-in-class Accuracy
The Meister S combines our innovative vision algorithms with advanced high resolution optics for the semiconductor industries. With these innovative technologies, Meister S is focused on delivering best-in-class performance, functionality and accessibility. Meister S’s inspection capability has already been qualified for mass production by major semiconductor and µLED manufacturers in Asia.
- High Resolution 12MP 5μm Optics with High Speed Camera
- Down to 10μm Thin Solder Inspection
- Warpage Compensation Solutions