VFF-300 Unit/Strip PCB repair system (Unit/Strip SR repair system)
Model: VFF-300
ENJET’s industry-leading EHD ultra-high-precision printing technology enables effective repair of PCB solder mask defects, ensuring that high-value substrates such as FCBGA no longer need to be scrapped due to open-circuit issues. This provides the optimal solution for significantly improving PCB manufacturing yield.
- UPH: 70 Defect [Defect Size : 50um(Outer dimension) x 20um(Depth) Repair]
- Product: Unit, Strip
- Applicable product type: PCB, EMC, Thin film coating repair
- Substrate Size: Jedec Tray (12.7x5.35inch)
- Repair range: 10um ~ 300um(Outer dimension) / 20um(Depth)
- Product supply form: MMI (Machine to machine interface) & Manual
- Foot point: (W)2850mm x (L)2100mm x (H)2300mm
- Weight: 5,500kg (5.5ton)